Model LH836 Automatic Back Grind Tape & Photo Resist Film Laminator from Longhill Industries, Ltd., utilizing
the unique and proven Longhill vacuum laminating process, no
troublesome rollers to clean and adjust, the tape or film and
wafer are brought together inside a vacuum chamber.
Vacuum laminating is especially adapted to bumped wafers.
During the vacuum laminating process there is a reduced atmosphere
captured between the wafer surface and the tape, this effect causes
the tape to more readily conform evenly over the bumps, especially around the wafer edge.
Programmable uniform tape tension minimizes wafer warp caused
by uneven tape tension. Programmable cutter excises the wafer from
the tape leaving no strings, burrs or leftover tape protrusions.
Double side laminating in one pass is added optional feature.